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 title={Embedded multi-die interconnect bridge (EMIB)—a high density, high bandwidth packaging interconnect},
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 booktitle={2016 IEEE 66th Electronic Components and Technology Conference (ECTC)},
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 year={2016},
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 title={Universal chiplet interconnect express (UCIe): An open industry standard for innovations with chiplets at package level},
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author = {Vantrease, Dana and Schreiber, Robert and Monchiero, Matteo and McLaren, Moray and Jouppi, Norman P. and Fiorentino, Marco and Davis, Al and Binkert, Nathan and Beausoleil, Raymond G. and Ahn, Jung Ho},
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url = {http://dx.doi.org/10.1109/ISCA.2008.35},
doi = {10.1109/ISCA.2008.35},

}

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author = {Kayvon Fatahalian and Mike Houston},
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booktitle = {Proceedings of the 35th Annual International Symposium on Computer Architecture},
series = {ISCA ‘08},
year = {2008},
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keywords = {Nanophotonics, Many-core CMP, On-chip Networks, 3D stacking},

}

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