gong2018duo
Summary
Seong-Lyong Gong, Jungrae Kim, Sangkug Lym, Michael Sullivan, Howard David, and Mattan Erez. DUO: Exposing On-Chip Redundancy to Rank-Level ECC for High Reliability. In the Proceedings of the IEEE International Symposium on High-Performance Computer Architecture (HPCA). Vienna, Austria, February, 2018, pages 1–14. (PDF)
Bibtex entry
@INPROCEEDINGS { gong2018duo,
AUTHOR = { Seong-Lyong Gong and Jungrae Kim and Sangkug Lym and Michael Sullivan and Howard David and Mattan Erez },
TITLE = { DUO: Exposing On-Chip Redundancy to Rank-Level ECC for High Reliability },
BOOKTITLE = { the Proceedings of the IEEE International Symposium on High-Performance Computer Architecture (HPCA) },
YEAR = { 2018 },
MONTH = { February },
PAGES = { 1-−14 },
ADDRESS = { Vienna, Austria },
DOI = { 10.1109/HPCA.2018.00064 },
MYCAT = { conference },
PDF = { /duo_hpca18.pdf },
}